Dear Student,
Greetings from ESCI !!!!
ESCI - The Institution of Engineers (India) [IEI] is a statutory body to promote and advance the engineering and technology, established in 1920. We are offering Industrial Training – Cum – Internship for Engineering Students with the collaboration of Industry Partners CompTIA, IIC Technologies, PDQ Softech, JUST SLASH and other Industry Partners.
500+ Students of 35+ Engineering Colleges / Diploma Colleges from PAN India successfully completed 4 Week Summer Industrial Training – Cum – Internship at ESCI with the collaboration of Industry partners.
Benefits of this Industrial Training – cum – Internship
1. Two Week Hands-on Practical Industrial Training.
2. Two Weeks Internship from Industry Partners.
3. Training Certification from ESCI- The Institution of Engineers(India)
4. Internship Certification from Industry.
5. Students will get real-time work experience.
Internship Domains are
1. IOT Data Analytics for CSE / ECE Students
2. Artificial Intelligence with Python for CSE / ECE Students
3. Web development using MEANs Stack for CSE / ECE Students
4. Geospatial Technology for Civil Engineers for Civil Students
Course Fee: Rs.4500 ( Inclusive of GST)
Please find the attached brochure.
if any quarries, Please contact Mr.Murali 9177461391 or Mr.Gafar 8143997446
Registration Link-https://forms.gle/ZFWUeY4HWn49HU9D8
Join CISCO WebEx meeting by downloading WebEx App from Google stare .
WebEx App link - https://play.google.com/store/apps/deta ... x.meetings
To register online Visit ESCI UpSkill - A Smart Learning Platform
Our YouTube channel https://www.youtube.com/channel/UCLsMFz ... rcYhzcFn1A
With Regards
Syed Azgar
Sr.Faculty & Head IT
Information Technology Division
Engineering Staff College of India (ESCI)
Autonomous Organ of The Institution of Engineers (India)
Hyderabad - 500032, Telangana, India
Phone : 040 - 66304124/23/25 / 8886661060
https://www.facebook.com/escihydIT/
ESCI Industrial Training – Cum – Internship Program 2021
ESCI Industrial Training – Cum – Internship Program 2021
- Attachments
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- Brochure
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